Rudolph Technologies   Thin Film Ellipsometer

The Rudolph Laser Instrument is utilized in class 10 wafer production facilities around the world. This instrument analyzes film thickness and pattern compliance on silicon wafers before they are converted into integrated circuits. TKDG conceived of a modular design for the packaging of the laser and robotic technology developed by Rudolph engineering team. The design and components had to comply with strict clean room requirements. TKDG produced final production files and oversaw initial beta production.

M E D I C A L

C O N S U M E R

I N D U S T R I A L

P A C K A G I N G